TECHBARRIER™

Durability against Boiling, Retort

TECHBARRIER™-T, TECHBARRIER™-NR are recommendable when boiling or retort treatment is necessary. “Gas Transmission Rate after Retort / Boiling” shows the property of each type. You can see also visual “Layer Structure Recommendation”.

Gas Transmission Rate after Retort / Boiling

Gas Barrier Water Vapor Transmission Rate
(g/㎡/day)		 Oxygen Transmission Rate
(cc/㎡/day/atm)		 Base Film
Condition Blank 110°C, 30min 120°C, 30min 130°C, 30min Blank 110°C, 30min 120°C, 30min 130°C, 30min

Structure

 T 0.3 0.5 0.5 1.0 0.3 0.5 0.5 2.0 OPET
TX 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.6 OPET
NR 0.7 0.7 1.0 2.2 0.5 0.5 0.5 1.5 OPA
Measurement ASTM F-1294 ASTM D-3985  

Reference data only.
Data as laminated film.

  • Structure :

    OPET(12㎛) // (SiOx) T(12㎛) // CPP(50㎛)
    TX(12㎛) (SiOx) // OPA(15㎛) // CPP(50㎛)
    OPET(12㎛) // (SiOx) NR(15㎛) // CPP(50㎛)

Layer Structure Recommendation

Structure Feature and Application
  • Sophisticated
  • World best Retort
  • Medical
  • Cost effective
  • OPA usable
  • Food
  • Nutrition/Medical
  • Drop Durability
  • Easy Printing
  • Less Migration
  • Food / Nutrition

1. Adhesive

Urethane adhesive (polyester system) is recommendable. You can find some information in a page of “Adhesive Information”. (detail>>)

2. Air-gap in a pouch

If air remains in a bag during boiling or retorting, the film will be inflated then its barrier property will be deteriorated. Air in a bag must be excluded.

3. TECHBARRIER™-T

  •  1.Up to 120°C retort sterilization is possible. Recommendable structures are as follows.
  • OPET(printing) // (SiOx) TECHBARRIER™-T // CPP
    TECHBARRIER™-T (SiOx) // CPP
  •  2. OPA film must not be laminated directly on SiOx surface, If the film is boiling or retorting treated. Because SiOx layer is deteriorated by OPA hydroscopic swelling. This phenomenon can be occurred as well as with the other water absorb-like film.

4. TECHBARRIER™-NR

Up to 120°C retort sterilization, when it is laminated with OPET, is possible. It must be always three(four)-ply-structure like,

  • OPET(printing) // (SiOx) TECHBARRIER™-NR // CPP
  • OPET(printing) // (SiOx) TECHBARRIER™-NR // OPA // CPP