TECHBARRIER


Extrusion Lamination

TECHBARRIER™ has superior gas barrier property so that measuring of transmission rate must be done carefully and accurately. Please find the following methods that we are doing.

  •  1.Extruded resin temperature
  •  2.Process Tension
  •  3.Thickness of extruded resin
  •  4.Anchor coating treatment

1. Extruded resin temperature

It must be below 310°C. Unless so, the base film of TECHBARRIER™ would be overheated then SiOx layer would be deteriorated. On the contrast, lower temperature extrusion makes bond strength weaker. In such a case EAA or EMAA resin is recommendable.

2. Process Tension

High tension stretches TECHBARRIER™ and deteriorates SiOx layer drastically. From gas barrier property point of view, the lower tension the better. Process tension must be below 1%.

3. Thickness of extruded resin

The thinner layer, the better. In other words, the less amount of heat is the better. The thicker resin deteriorates SiOx layer with heat. Approximately 20㎛ thickness is recommendable. So-called “Polymer sandwich” method is recommendable, too because it cools the extruded resin faster.

4. Anchor coating treatment

Anchor coating on SiOx layer of TECHBARRIER™ makes the bond strength stronger with extruded layer. The following Anchor coating agents are recommendable.

  •  1.Dai-Nippon-Seika : 2703A / 2703B
  •  2.Toyo-Morton : AD900 / CAT-RT85