TECHBARRIER™
TECHBARRIER™ has superior gas barrier property so that measuring of transmission rate must be done carefully and accurately. Please find the following methods that we are doing.
It must be below 310°C. Unless so, the base film of TECHBARRIER™ would be overheated then SiOx layer would be deteriorated. On the contrast, lower temperature extrusion makes bond strength weaker. In such a case EAA or EMAA resin is recommendable.
High tension stretches TECHBARRIER™ and deteriorates SiOx layer drastically. From gas barrier property point of view, the lower tension the better. Process tension must be below 1%.
The thinner layer, the better. In other words, the less amount of heat is the better. The thicker resin deteriorates SiOx layer with heat. Approximately 20㎛ thickness is recommendable. So-called “Polymer sandwich” method is recommendable, too because it cools the extruded resin faster.
Anchor coating on SiOx layer of TECHBARRIER™ makes the bond strength stronger with extruded layer. The following Anchor coating agents are recommendable.