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- 1) Extruded resin temperature
- It must be below 310
 . Unless so, the base film of TECHBARRIER would be overheated then SiOx layer would be deteriorated. On the contrast, lower temperature extrusion makes bond strength weaker. In such a case EAA or EMAA resin is recommendable.
- 2) Process Tension
- High tension stretches TECHBARRIER and deteriorates SiOx layer drastically. From gas barrier property point of view, the lower tension the better. Process tension must be below 1%.
- 3) Thickness of extruded resin
- The thinner layer, the better. In other words, the less amount of heat is the better. The thicker resin deteriorates SiOx layer with heat. Approximately 20
 m thickness is recommendable. So-called "Polymer sandwich" method is recommendable, too because it cools the extruded resin faster.
- 4) Anchor coating treatment
- Anchor coating on SiOx layer of TECHBARRIER makes the bond strength stronger with extruded layer. The following Anchor coating agents are recommendable.
| a) Dai-Nippon-Seika | : 2703A / 2703B |
| b) Toyo-Morton | : AD900 / ADRT5 |
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